By Robert Zorich
Here's a complete sensible consultant to complete wafer fabrication approach from A to Z. Written through a training approach engineer with years of expertise, this ebook offers an intensive creation to the complicated box of IC production, together with wafer sector format and layout, yield optimization, just-in-time administration platforms, statistical quality controls, fabrication gear and its setup, and cleanroom thoughts. furthermore, it includes a wealth of data on universal method difficulties: the right way to observe them, tips to make certain them, and the way to unravel them. even if you're a new enginner or technician simply getting into the sector, a fabrication supervisor searching for how one can increase caliber and construction, or somebody who could similar to to grasp extra approximately IC production, this is often the publication you are looking for.
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Extra info for Handbook of Quality Integrated Circuit Manufacturing
This has had a direct impact on the requirements for defect, particulate, and quality control in the wafer fabs. The more extreme the density requirements of the technology, the more extreme the requirements for clean manufacturing conditions, and the higher the consequent cost of the wafer fab will be, in both operating costs and initial construction costs. The increase in the density of the devices does not necessarily relate to changes in size of the average integrated circuit, although the ability to shrink an existing design to reduce manufacturing costs is a significant driving force in the industry.
It is assumed that particles larger than this can cause short circuits through intervening dielectric films. The other view, more prevalent in Japan, is that this threshold is no greater than one-tenth the minimum linewidth. The difference in these numbers is measured in terms of manufacturing costs, as it is much more costly to build chips at the higher levels of cleanliness. The other primary issue when dealing with particles is their impact as a function of film thickness. Since even the very smallest particles detectable are very large in comparison to thin gate oxidation thicknesses, it must be assumed that all particles are capable of causing damage to the critical transistor regions.
One of the most critical components of the linewidth decision is that of how much power must be run through the line. , CMOS, bipolar, etc), and the material -5 μην 1 μπΊ ΨΧ 1 jim • Figure 1-17. Contact Density as a Function of Reduced Linewidth 1-μπι contacts can be placed in the area of one square 5-μ,πι contact. Nine square 24 1. OVERVIEW OF SEMICONDUCTOR MANUFACTURING being used to carry the current. An excess amount of power sent to an element of the chip that cannot handle it is likely to result in failure of that element.
Handbook of Quality Integrated Circuit Manufacturing by Robert Zorich